Federal 5218 filler belonging to a single component of fast curing epoxy filler. Curing temperature is 120 degrees, good flowability, filling the gap of less than 25
microns, same viscosity of the glue, has excellent flexibility and maintainability. Typical useing: Mainly for the protection after filling the CSP; BGA and UBGA. For example: mobile phones, laptop computers and so on. Characteristics before curing: Basal chemical material composition: Epoxy resin. Outlooks: Light yellow transparent liquid. Packaging specifications
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Trade Leads Directory -> All Trade Leads -> Chemicals -> Inorganic Chemicals -> Underfilled Adhesive 5218
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