S2000 wire saw
Introduction
S2000 wire saw can cut silicon
ingots into thin wafers for both
mono-crystal and poly-crystal, by means of an abrasive liquid
(Slurry) carried by a multi-wire
web. Easy access to the double
table allows loading 4 ingots up
to 2000mm length. The system
provides the highest
productivity in PV industry, and
is a proven platform for
advanced wire saw technology. For maintaining the constant
slurry temperature purpose, S2000 equipped 2 cooling
circulates. parameter: Wire Saw model S2000
Working capacity
156mm*156mm*500mm*4
wire web width 500 mm
wire guides length 520 mm
wire guides diameter 300 mm
wire speed max 18 m/s
cutting speed 0~9000
um/min
travel (depends on clamping) max 270 mm
number of tables 2
Electrical hooking 50 or 60 Hz
3x400 VAC
wire guides drives power
2x61 kW
average power (without
cooling
compressor) 156 KVA
Air pressure 4~6 bar
Dimension LxWxH
4620mm*2180mm*3550mm
weight 13.5T
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