Power supply: AC 220V/50-60HZ
Heating Method: Two-side infrared heating
Demension: Lmm360*Wmm520*H430mm
Maximum Power:2.3KW
PCB size:405mm*310mm
Temperature Control Method
Heating controlled independently: Yes
Upper heating control method: High-precision closed-loop control, instrument error is about 0.5%
Upper temperature control and measuring method: High sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element) Bottom heating control method: High-precision closed-loop control, instrument error is about 0.5%
Bottom temperature control and measuring method: High sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element) Rework station Function
Application type: Be suitable for welding, sealing-off or repairing BGA, PBGA, CSP on different PCB and more kinds of encapsulation mode component, all suitable for lead or lead-free soldering. Suitable chip size: less than 50mm
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